XCZU7EV-2FFVC1156I

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XCZU7EV-2FFVC1156I

IC SOC CORTEX-A53 1156FCBGA

  • Производитель
  • Мфр. Часть #XCZU7EV-2FFVC1156I
  • Пакет FCBGA-1156
  • Лист данных
  • В наличии4843

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Спецификации

Package Tray
Series Zynq® UltraScale+™ MPSoC EV
ProductStatus Active
Architecture MCU, FPGA
CoreProcessor Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™, ARM Mali™-400 MP2
RAMSize 256KB
Peripherals DMA, WDT
Connectivity CANbus, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG
Speed 533MHz, 600MHz, 1.3GHz
PrimaryAttributes Zynq®UltraScale+™ FPGA, 504K+ Logic Cells
OperatingTemperature -40°C ~ 100°C (TJ)
Package/Case 1156-BBGA, FCBGA

Обзор

Description

The XCZU7EV-2FFVC1156I is a high-performance System on Chip (SoC) from Xilinx's Zynq UltraScale+ MPSoC family. This device combines a multi-core ARM Cortex-A53 processor with a dual-core ARM Cortex-R5 real-time processor and programmable logic (FPGA) fabric, providing a versatile platform for various applications.
Key features include:
- Processing Cores: Quad-core ARM Cortex-A53 for high-performance applications and dual-core ARM Cortex-R5 for real-time processing.
- FPGA Fabric: The programmable logic allows for custom hardware acceleration and integration of digital circuits alongside the microprocessors.
- I/O Options: Supports a wide range of interfaces including PCIe, USB, and Ethernet, enhancing connectivity and scalability.
- Memory Support: Offers support for DDR4 memory, providing high bandwidth for data-intensive applications.
This SoC is ideal for applications in communications, automotive, industrial automation, and more, enabling efficient processing, flexibility, and high integration in a single chip design.

Features

The XCZU7EV-2FFVC1156I is a part of Xilinx's Zynq UltraScale+ MPSoC family, which integrates a powerful combination of ARM processing with FPGA capabilities. Key features include:
- Processing System: Dual-core ARM Cortex-A53 and a dual-core ARM Cortex-R5 for real-time processing.
- FPGA Fabric: Configurable logic with 6,840 logic cells and rich programmable interconnect.
- Memory Interfaces: Supports DDR4 and LPDDR4 memory, with a maximum bandwidth of 25.6 Gbps.
- High-speed I/O: Multiple transceivers supporting up to 28.8 Gbps, suitable for high-speed communication.
- Embedded DSP: 220 DSP slices for high-performance signal processing tasks.
- Connectivity Options: Includes PCIe, Ethernet, and various GPIO interfaces, enhancing connectivity capabilities.
- Power Efficiency: Designed for optimized power consumption, making it suitable for embedded applications.
Overall, the XCZU7EV-2FFVC1156I is ideal for applications in automotive, industrial, and telecommunications sectors requiring high performance and flexibility.

Package

The XCZU7EV-2FFVC1156I is packaged in a FFG (Fine Pitch Flip Chip) form factor. Specifically, it features a 1156-ball FFC (Flip Chip Ball Grid Array) configuration, which allows for high-density interconnections suitable for advanced applications.

Pinout

The XCZU7EV-2FFVC1156I is a part of the Xilinx Zynq Ultrascale+ family, specifically designed for high-performance applications. It features a total of 1156 pins.
This device integrates a dual-core ARM Cortex-A53 processor with a real-time ARM Cortex-R5 processor and a programmable logic (FPGA) section, allowing for flexible hardware acceleration. The pin functions include general-purpose I/O (GPIO), high-speed transceivers, clock inputs, power supply connections, and dedicated pins for configuration and programming.
In addition, the XCZU7EV supports various interfaces such as PCIe, USB, and Ethernet, enabling connectivity for advanced applications in areas such as telecommunications, automotive, and industrial automation. It is packaged in a Fine Pitch BGA (Ball Grid Array) configuration that facilitates high-density designs.

Manufacturer

The XCZU7EV-2FFVC1156I is manufactured by Xilinx, a company that specializes in the design and production of programmable logic devices, including field-programmable gate arrays (FPGAs) and system-on-chips (SoCs). Xilinx is known for its innovative technologies in the realm of adaptable computing and has a significant presence in various sectors, including telecommunications, automotive, aerospace, and industrial applications. In 2020, Xilinx was acquired by Advanced Micro Devices (AMD), further enhancing its capabilities in high-performance computing and flexible solutions. Xilinx's products are widely used for applications requiring customization and high processing efficiency, making it a key player in the semiconductor industry.

Application

The XCZU7EV-2FFVC1156I is a versatile FPGA from Xilinx's Zynq UltraScale+ family, commonly used in areas such as automotive applications, machine learning, video processing, industrial automation, and communication systems. Its high performance and integrated processing capabilities make it suitable for edge computing, image and signal processing, and real-time data analytics in various industries like aerospace, defense, and telecommunications.

Equivalent

The XCZU7EV-2FFVC1156I is a part of the Xilinx Zynq UltraScale+ MPSoC family. Equivalent products include:
1. XCZU7EV-2FFVC1156 (without the 'I' suffix, same specs)
2. XCZU7EV-3FFVC1156I (higher performance variant)
3. XCZU7EV-2FFVC1156E (industrial grade)
For specific applications, consider similar Zynq Ultrascale models based on your requirements for performance, power, and package type. Always verify compatibility for your project needs.

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