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S29GL256P90TFCR10

Name: S29GL256P90TFCR10
Rating: 4.7 (12 reviews)

IC FLASH 256MBIT PARALLEL 56TSOP

Производитель
Мфр. Часть #S29GL256P90TFCR10
Пакет
Лист данных S29GL256P90TFCR10 DataSheet
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Спецификации

Series	GL-P
Part Status	Obsolete
DigiKey Programmable	Not Verified
Memory Type	Non-Volatile
Memory Format	FLASH
Technology	FLASH - NOR
Memory Size	256Mbit
Memory Organization	32M x 8
Memory Interface	Parallel
Write Cycle Time - Word, Page	90ns
Access Time	90 ns
Voltage - Supply	3V ~ 3.6V
Operating Temperature	0°C ~ 85°C (TA)
Mounting Type	Surface Mount
Package / Case	56-TFSOP (0.724", 18.40mm Width)
Supplier Device Package	56-TSOP
Base Product Number	S29GL256

Обзор

Description

The S29GL256P90TFCR10 is a 256 megabit (32 megabyte) Serial NOR Flash memory, manufactured by Cypress Semiconductor. It features a high-speed interface with a maximum clock frequency of 90 MHz, enabling fast read and write operations. This device is designed for applications requiring high-density non-volatile storage, such as embedded systems, automotive, and industrial applications.
Key features include:
- Architecture: Serial interface with a single data line, allowing for simpler connections and reduced pin count.
- Density: 256 Mbit capacity, suitable for storing firmware, configuration data, and other critical information.
- Speed: Fast read speeds up to 90 MHz and efficient programming/erasing capabilities.
- Endurance: Typically rated for 100,000 program/erase cycles, ensuring data integrity over time.
- Data Retention: Guarantees data retention for up to 20 years at room temperature.
This chip is ideal for applications that require performance and reliability in compact form factors.

Package

The S29GL256P90TFCR10 is packaged in a 48-pin TSOP (Thin Small Outline Package), specifically designed for high-density memory applications.

Pinout

The S29GL256P90TFCR10 is a 256 Mb (32 MB) NAND Flash memory device from Spansion (now part of Cypress Semiconductor). It has a total of 44 pins.
The main functions of these pins include:
1. Address Pins (A0-A23): Used for addressing the memory locations.
2. Data Pins (DQ0-DQ7): 8 data input/output pins for data transfer.
3. Chip Enable (CE): Activates the chip for operation.
4. Write Enable (WE): Controls write operations.
5. Output Enable (OE): Controls the output data from the memory.
6. Byte/Word (B/W): Selects between byte or word data access.
7. Reset (RESET): Resets the device.
8. Vcc: Power supply pin.
9. GND: Ground reference pin.
This device supports asynchronous read and programming operations, ideal for storage applications in various electronic devices.

Manufacturer

The manufacturer of the S29GL256P90TFCR10 is Spansion, which is known for its semiconductor products, particularly flash memory solutions. Spansion was formed as a joint venture between AMD and Fujitsu, specializing in manufacturing NOR flash memory devices, which are commonly used in various applications, including automotive, industrial, and consumer electronics. The S29GL256P90TFCR10 is a 256Mb (megabit) NOR flash memory chip designed for high-performance applications, offering features like fast read and write speeds, along with flexibility in data storage. Spansion has since merged with Cypress Semiconductor, which was later acquired by Infineon Technologies, further expanding its portfolio in the semiconductor industry.

Application

The S29GL256P90TFCR10 is a 256Mb NOR flash memory used in various applications such as consumer electronics, automotive systems, telecommunications, and industrial control. It is suitable for firmware storage, code execution, and data retention in devices like smartphones, tablets, and embedded systems due to its fast read speeds and reliability.

Equivalent

The S29GL256P90TFCR10 is a 256Mb (32MB) NOR Flash memory chip. Equivalent products include the Micron MT28EW256ABA1, Spansion S29GL256N90TFI010, and Winbond W25Q256JV. Compatibility may vary based on specific requirements like voltage, temperature range, and interface, so it's essential to verify datasheets for exact specifications.

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