MT53E768M32D4DT-053 AIT:E

The MT53E768M32D4DT-053 AIT:E is a DDR3 SDRAM memory component produced by Micron Technology. It features a capacity of 768 megabits (or 96 megabytes) and is organized in a 32-bit wide data bus configuration. This memory chip operates at a speed of 1066 MT/s (megatransfers per second) with a clock frequency of 533 MHz, making it suitable for various applications requiring efficient data processing.
The "MT53" series is part of Micron's mobile DRAM lineup, designed for low power consumption and high performance, making it ideal for mobile devices, tablets, and other portable electronics. The designation "AIT:E" typically indicates specific performance and temperature grades, which govern its operational stability and reliability under different environmental conditions.
Overall, the MT53E768M32D4DT-053 AIT:E is engineered to meet the demands of modern electronics, offering a balance of speed, capacity, and energy efficiency.

The MT53E768M32D4DT-053 AIT:E is a 4 Gb (gigabit) DDR3 SDRAM memory chip from Micron Technology. It features a x32 configuration, which means it has a 32-bit data width, making it suitable for various applications requiring high-speed memory access. Key features include:
1. Speed: Operates at a data rate of 1066 MT/s (megatransfers per second), offering efficient performance for memory-intensive tasks.
2. Density: Each chip has a capacity of 512 MB, allowing multiple chips to be used for higher memory capacity in systems.
3. Package Type: Comes in a standard FBGA (Fine Ball Grid Array) package, facilitating easy integration into circuit boards.
4. Power: Designed for low power consumption, supporting voltage levels of 1.5V, which aids in reducing overall system power usage.
5. Applications: Commonly used in applications such as networking equipment, telecommunications, and consumer electronics.
This chip is particularly valued for its balance of speed, efficiency, and capacity, making it suitable for both enterprise and consumer applications.

The MT53E768M32D4DT-053 AIT:E is a memory chip from Micron Technology, typically packaged in a TFBGA (Thin Fine Ball Grid Array) format. This package type provides a compact design suitable for high-density memory applications.

The MT53E768M32D4DT-053 AIT:E is a DDR4 memory chip with a pin count of 78. This component is part of Micron Technology's DRAM product line and is designed for high-performance applications. Its primary function is to provide high-speed memory storage for various computing devices, supporting features such as low power consumption and enhanced data transfer rates. The chip operates with a data width of 32 bits and is typically used in server and enterprise applications, offering reliability and efficiency.

The manufacturer of the MT53E768M32D4DT-053 AIT:E is Micron Technology, Inc. Micron is an American multinational corporation that specializes in the production of semiconductor devices, particularly memory and storage solutions. Founded in 1978 and headquartered in Boise, Idaho, Micron is one of the leading suppliers of DRAM, NAND flash memory, and other memory technologies used in various applications, including computers, mobile devices, and enterprise storage systems. The company is known for its innovation in memory products and plays a significant role in the global semiconductor industry.

The MT53E768M32D4DT-053 AIT:E is a high-performance DRAM memory chip primarily used in applications such as networking devices, telecommunications, and high-performance computing systems. Its features make it suitable for data-intensive tasks, including server memory, storage solutions, and graphics processing in advanced computing environments.

The MT53E768M32D4DT-053 AIT:E chip is a DDR4 SDRAM memory device. Equivalent products can include other DDR4 SDRAM chips with similar specifications like speed (e.g., 2400 MT/s), capacity (e.g., 8GB), and organization (e.g., x32). Examples include Samsung K4A8G085WB-BCRC, Hynix H5AN8G6NCFR, and Micron MT40A1G8SA-075. Always verify compatibility based on specific application requirements and datasheets.