EP3SL150F1152I3N

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EP3SL150F1152I3N

IC FPGA 744 I/O 1152FBGA

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  • Мфр. Часть #EP3SL150F1152I3N
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  • Лист данных EP3SL150F1152I3N DataSheet
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Спецификации

Series Stratix® III L
Part Status Obsolete
DigiKey Programmable Not Verified
Number of Logic Elements/Cells 142500
Total RAM Bits 6543360
Number of I/O 744
Voltage - Supply 0.86V ~ 1.15V
Mounting Type Surface Mount
Operating Temperature -40°C ~ 100°C (TJ)
Package / Case 1152-BBGA, FCBGA
Supplier Device Package 1152-FBGA (35x35)
Base Product Number EP3SL150
Number of LABs/CLBs 5700

Обзор

Description

The EP3SL150F1152I3N is a part of the Stratix III family of FPGAs (Field-Programmable Gate Arrays) manufactured by Intel (formerly Altera). These devices are designed for high-performance applications, offering advanced features such as high-density logic, efficient power usage, and high-speed connectivity.
Key Features:
1. Architecture: Built on a high-performance logic structure with a focus on balancing power efficiency and processing capacity.
2. Density: Offers a large number of logic elements, in this case, around 150,000, which allows for complex designs and computations.
3. I/O Support: Includes multiple I/O standards and high-speed transceivers to support a range of communication protocols.
4. Power Optimization: Incorporates features for dynamic and fine-grained power management, making it suitable for power-sensitive applications.
5. Advanced Design Tools: Supported by Intel's Quartus Prime design software, providing comprehensive tools for development, simulation, and testing.
Applications:
The EP3SL150F1152I3N is suitable for demanding applications like telecommunications, data centers, high-speed computing, and any systems requiring robust data processing and signal management capabilities.

Features

The EP3SL150F1152I3N is a member of Altera's Stratix III FPGA family, designed for high-performance and high-density applications. Key features include:
1. Logic Elements: It contains approximately 149,760 logic elements, suitable for complex designs.

2. Embedded Memory: The device provides around 5.8 Mbits of embedded memory, which is useful for data storage and processing.
3. DSP Blocks: It includes 384 18x18 multipliers for digital signal processing tasks, enhancing computational capabilities.
4. I/O Features: The FPGA supports multiple I/O standards with up to 1,152 pins, making it versatile for various interfacing requirements.
5. Transceivers: It features high-speed transceiver blocks for high-bandwidth data transfer.
6. Power Management: Advanced power management features are integrated to optimize power consumption.
7. Process Technology: Built using 65nm process technology, it balances performance and power efficiency.
8. Configuration: The device utilizes SRAM-based configuration, allowing for flexibility and reconfigurability.
9. Temperature Range: It is designed to operate in a commercial temperature range.
These features make the EP3SL150F1152I3N suitable for applications in telecommunications, networking, and other demanding digital processing environments.

Package

The EP3SL150F1152I3N is a Field Programmable Gate Array (FPGA) from Altera's Stratix III family. It comes in a FineLine BGA package with 1152 pins. This package type is designed to offer high-density integration and efficient thermal management, suitable for high-performance applications.

Pinout

The EP3SL150F1152I3N is part of Altera's (now Intel's) Stratix III FPGA family. It comes in a FineLine BGA package with 1152 pins. This FPGA is designed for high-performance applications and provides a range of features, including a large number of logic elements, embedded memory blocks, DSP blocks, and high-speed transceivers, which are suitable for complex digital signal processing tasks.
The functions of the EP3SL150F1152I3N include:
1. Logic Elements: Used for implementing custom logic circuits.
2. Embedded Memory: Provides on-chip memory for data storage and retrieval.
3. DSP Blocks: Optimize performance for digital signal processing applications.
4. High-Speed Transceivers: Allow for rapid data transfer and communication.
5. I/O Pins: Offer flexible interfacing with external devices and systems.
6. Clock Management: Supports various clock inputs for synchronization purposes.
These features make the EP3SL150F1152I3N suitable for a wide range of applications, including telecommunications, data processing, and other high-complexity digital systems.

Manufacturer

The EP3SL150F1152I3N is manufactured by Altera Corporation, which is now part of Intel Corporation. Altera was a company specializing in programmable logic devices (PLDs), including FPGAs (Field-Programmable Gate Arrays), which are used in a wide range of applications for custom hardware functionality. In 2015, Altera was acquired by Intel, expanding Intel's product portfolio into the FPGA market. Intel now continues to develop and manufacture FPGA products under the Intel Programmable Solutions Group.

Application

The EP3SL150F1152I3N is a member of the Altera Stratix III FPGA family and is commonly used in high-performance computing applications. Its application areas include telecommunications infrastructure, signal processing, high-speed data transfer, networking equipment, military and aerospace systems, and advanced medical imaging. Its features, such as high logic density, low power consumption, and robust processing capabilities, make it suitable for tasks requiring rapid data processing and complex algorithm execution.

Equivalent

The EP3SL150F1152I3N is an Altera Stratix III FPGA. Equivalent products would be other FPGAs with similar capabilities and specifications. These could include the Xilinx Virtex-5 series, such as the XC5VLX155, or the Lattice ECP3 series, like the LFE3-150. These alternatives offer high logic density, performance, and are suitable for high-end applications similar to the Stratix III series. Always verify the specific requirements and compatibility for your applications when considering equivalents.

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