BCM68626B0IFSBG

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BCM68626B0IFSBG

4XGPON/4XEPON OLT, I-TEMP

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Спецификации

Part Status Active
Function EPON OLT
Operating Temperature -40°C ~ 85°C

Обзор

Description

The BCM68626B0IFSBG is a highly integrated system-on-chip (SoC) designed by Broadcom, primarily targeted for broadband and networking applications. It features a dual-core ARM Cortex-A53 processor, which provides efficient processing capabilities for various tasks. This SoC supports advanced networking features, including high-speed Ethernet interfaces and Wi-Fi connectivity, making it suitable for applications like home routers, gateways, and access points.
Additionally, the BCM68626B0IFSBG incorporates hardware acceleration for packet processing and supports multiple network protocols, enhancing its performance in handling data traffic. Its energy-efficient design ensures optimal power consumption, making it ideal for residential and commercial networking solutions. By integrating various functionalities into a single chip, it simplifies design and reduces the overall system cost for manufacturers. Overall, the BCM68626B0IFSBG is a versatile and powerful solution for modern networking needs.

Features

The BCM68626B0IFSBG is a highly integrated wireless communication chip from Broadcom, designed primarily for broadband applications. Key features include:
1. Dual-Band Wi-Fi: Supports both 2.4 GHz and 5 GHz bands, enabling efficient wireless communication.
2. 802.11ac Support: Provides high-speed data transfer with advanced features like MIMO (Multiple Input Multiple Output) for improved performance.
3. Integrated Bluetooth: Offers Bluetooth 5.0 capabilities for seamless device connectivity and low-energy operations.
4. Advanced Security: Incorporates robust security protocols for secure data transmission.
5. Low Power Consumption: Engineered for energy efficiency, making it suitable for battery-operated devices.
6. Multiple I/O Interfaces: Facilitates easy integration with various peripherals and systems.
7. Enhanced Performance: Optimized for high throughput, making it ideal for high-demand applications such as streaming and gaming.
Overall, the BCM68626B0IFSBG is aimed at providing reliable, high-speed wireless connectivity in consumer electronics, home automation, and IoT devices.

Package

The BCM68626B0IFSBG is packaged in a QFN (Quad Flat No-lead) format, specifically a 56-pin QFN. This type of package is known for its compact size and efficient thermal performance, making it suitable for various applications in networking and communication devices.

Pinout

The BCM68626B0IFSBG is a system-on-chip (SoC) designed by Broadcom, primarily used in networking applications such as cable modems and gateways. It features a pin count of 256.
Key functions of the BCM68626B0IFSBG include integrated support for DOCSIS 3.1, advanced CPU and memory interfaces, and multiple Ethernet ports for connectivity. It is designed to handle high-speed data processing and provides capabilities for voice over IP (VoIP) and other multimedia streaming applications. Its architecture supports features such as security protocols and dual-band Wi-Fi, catering to modern broadband needs.
For specific pin assignments and detailed functionality, refer to the official Broadcom datasheet or technical documentation.

Manufacturer

The BCM68626B0IFSBG is manufactured by Broadcom Inc., a global technology company headquartered in San Jose, California. Broadcom specializes in designing and supplying a broad range of semiconductor and infrastructure software solutions. Their products serve various markets, including data center, networking, software, broadband, wireless, and storage, among others. Broadcom is known for its innovations in communication and connectivity technologies, playing a significant role in the development of the internet and wireless communications. The company focuses on providing cutting-edge solutions that enhance performance, efficiency, and connectivity across various devices and applications.

Application

The BCM68626B0IFSBG is a Wi-Fi 6 (802.11ax) system-on-chip (SoC) primarily used in broadband access devices such as routers, gateways, and residential customer premise equipment (CPE). Its application areas include high-speed internet access, smart home devices, IoT solutions, and enterprise networking, enabling improved connectivity, performance, and efficiency in wireless communications.

Equivalent

The BCM68626B0IFSBG chip, a Broadcom Wi-Fi and Bluetooth combo solution, has equivalent products including the Qualcomm QCA9377, Marvell Avastar 88W8897, and Intel Dual Band Wireless-AC 7265. These alternatives also provide integrated Wi-Fi and Bluetooth functionalities suitable for similar applications in wireless communication.

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Ссылка на плату за доставку (DHL/FedEx):

DHL компанией: Стоимость доставки варьируется от 25 до 45 долларов США (0,5 кг), при этом предполагаемое время доставки составляет 2-5 рабочих дней.

компании FedEx: Стоимость доставки варьируется от 25 до 40 долларов США (0,5 кг), при этом предполагаемое время доставки составляет 3-7 рабочих дней.

УПС: Стоимость доставки варьируется от 25 до 45 долларов США (0,5 кг), при этом предполагаемое время доставки составляет 3-7 рабочих дней.

ТНТ: Стоимость доставки варьируется от 25 до 65 долларов США (0,5 кг), при этом предполагаемое время доставки составляет 3-7 рабочих дней.

ЭМС: Стоимость доставки варьируется от $30-$50 (0,5 кг), с предполагаемым сроком доставки 7-15 рабочих дней.

Зарегистрированная воздушная почта: Стоимость доставки составляет 2-4 доллара США (0,1 кг), при этом предполагаемое время доставки составляет 5-20 рабочих дней.

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