TO-208AD, TO-83-3, Stud

горячий пакет

• MSOP-8
• 1017-FBGA
• 100-VFQFN
• 12-TSSOP Exposed Pad
• 1023-BBGA
• µDFN-8
• 100-HLQFP (14x14)
• 100-CLCC
• 10-SOIC (0.154", 3.90mm Width)
• 12-DIP(0.300",7.62mm)
• 100-TFBGA
• 8-PDIP
• 10-LCCC Exposed Pad
• 48-HLQFP (7x7)
• 10-TFSOP